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产品型号BLV103的概述

芯片BLV103的概述 BLV103是一种双极型功率放大器,广泛应用于无线通信系统和广播设备中。这种器件具有高增益、高线性度和良好的频率特性,适合于信号传输和放大,尤其在UHF和VHF频段表现尤为突出。由于其出色的性能,BLV103在市场上得到了广泛使用,并且在许多无线协议和应用领域展现出良好的兼容性和可靠性。 芯片BLV103的详细参数 BLV103的技术规格包括: 1. 频率范围:该芯片支持频率范围为100 MHz至1 GHz,使其能适应多种应用。 2. 增益:其典型增益在24 dB至28 dB之间,能够有效增强信号强度。 3. 输出功率:最大输出功率约为1 W,适合大多数常规应用。 4. 输入和输出阻抗:输入阻抗通常为50Ω,输出阻抗同样为50Ω,简化了与其他组件的配合。 5. 电源电压:通常工作电压为12 V至15 V,这样的设计既保证了幅度,又实现了功率的有效管理。 6. 偏...

产品型号BLV103的Datasheet PDF文件预览

DISCRETE SEMICONDUCTORS  
DATA SHEET  
BLV103  
UHF power transistor  
March 1993  
Product specification  
Philips Semiconductors  
Product specification  
UHF power transistor  
BLV103  
FEATURES  
QUICK REFERENCE DATA  
RF performance at Th = 25 °C in a common emitter test circuit.  
Internal matching for an optimum  
wideband capability and high gain  
f
VCE  
(V)  
PL  
(W)  
Gp  
(dB)  
ηC  
(%)  
MODE OF OPERATION  
(MHz)  
Emitter-ballasting resistors for  
optimum temperature profile  
c.w. class-AB  
960  
24  
4
> 11.5  
> 45  
Gold metallization ensures  
excellent reliability.  
WARNING  
Product and environmental safety - toxic materials  
DESCRIPTION  
This product contains beryllium oxide. The product is entirely safe provided  
that the BeO disc is not damaged. All persons who handle, use or dispose of  
this product should be aware of its nature and of the necessary safety  
precautions. After use, dispose of as chemical or special waste according to  
the regulations applying at the location of the user. It must never be thrown  
out with the general or domestic waste.  
NPN silicon planar epitaxial transistor  
encapsulated in a 6-lead SOT171  
flange envelope with a ceramic cap. It  
is intended for common emitter,  
class-AB operation in cellular radio  
base stations in the 960 MHz  
frequency band. All leads are isolated  
from the mounting base.  
PIN CONFIGURATION  
PINNING - SOT171  
k, halfpage  
PIN  
DESCRIPTION  
emitter  
1
2
3
4
5
6
c
1
2
4
6
emitter  
base  
handbook, halfpage  
3
5
b
collector  
emitter  
emitter  
e
MBB012  
MBA931 - 1  
Top view  
Fig.1 Simplified outline and symbol.  
March 1993  
2
Philips Semiconductors  
Product specification  
UHF power transistor  
BLV103  
LIMITING VALUES  
In accordance with the Absolute Maximum System (IEC 134).  
SYMBOL  
VCBO  
PARAMETER  
collector-base voltage  
CONDITIONS  
open emitter  
MIN.  
MAX.  
50  
UNIT  
V
VCEO  
VEBO  
IC  
collector-emitter voltage  
emitter-base voltage  
open base  
30  
V
open collector  
DC or average value  
Tmb = 25 °C  
4
V
collector current  
1.25  
17  
A
Ptot  
Tstg  
Tj  
total power dissipation  
storage temperature range  
junction operating temperature  
W
°C  
°C  
65  
150  
200  
MRA366  
MRA365  
5
25  
handbook, halfpage  
handbook, halfpage  
P
tot  
(3)  
(W)  
I
C
(A)  
20  
(2)  
(1)  
o
T
= 25  
(1)  
C
mb  
15  
10  
5
1
o
T
= 70 C  
h
0.1  
1
0
2
10  
10  
0
20  
40  
60  
80  
100  
T
120  
V
(V)  
CE  
o
( C)  
h
(1) Continuous DC operation.  
(2) Continuous RF operation.  
(1) Second breakdown limit (independent of temperature).  
(3) Short time operation during mismatch.  
Fig.2 DC SOAR.  
Fig.3 Power/temperature derating.  
THERMAL RESISTANCE  
SYMBOL  
Rth j-mb  
PARAMETER  
CONDITIONS  
Tmb = 25 °C;  
Pdis = 17 W  
MAX.  
UNIT  
from junction to mounting base  
10.3  
0.4  
K/W  
Rth mb-h  
from mounting base to heatsink  
K/W  
March 1993  
3
Philips Semiconductors  
Product specification  
UHF power transistor  
BLV103  
CHARACTERISTICS  
Tj = 25 °C.  
SYMBOL  
PARAMETER  
collector-base breakdown voltage  
CONDITIONS  
open emitter;  
IC = 4 mA  
MIN. TYP. MAX. UNIT  
V(BR)CBO  
50  
30  
4
1
8
V
V(BR)CEO  
V(BR)EBO  
ICES  
collector-emitter breakdown voltage open base;  
IC = 30 mA  
V
emitter-base breakdown voltage  
collector-emitter leakage current  
DC current gain  
open collector;  
IE = 2 mA  
V
VBE = 0;  
VCE = 30 V  
mA  
hFE  
VCE = 25 V;  
IC = 300 mA  
20  
40  
6.6  
Cc  
collector capacitance  
VCB = 25 V;  
IE = Ie = 0;  
f = 1 MHz  
pF  
pF  
Cre  
feedback capacitance  
VCE = 25 V;  
IC = 20 mA;  
f = 1 MHz  
3.5  
4.5  
MRA361  
MRA358  
20  
50  
handbook, halfpage  
handbook, halfpage  
h
FE  
V
= 25 V  
CE  
C
c
(pF)  
40  
30  
20  
10  
5 V  
10  
0
0
0
0
0.2  
0.4  
0.6  
0.8  
1
10  
20  
30  
I
(A)  
V
(V)  
C
CB  
IE = ie = 0; f = 1 MHz.  
Fig.4 DC current gain as a function of collector  
current, typical values.  
Fig.5 Collector capacitance as a function of  
collector-base voltage, typical values.  
March 1993  
4
Philips Semiconductors  
Product specification  
UHF power transistor  
BLV103  
APPLICATION INFORMATION  
RF performance at Th = 25 °C in a common emitter test circuit, Rth mb-h = 0.4 K/W.  
f
VCE  
(V)  
ICQ  
(mA)  
PL  
(W)  
GP  
(dB)  
ηc  
(%)  
MODE OF OPERATION  
(MHz)  
c.w. class-AB  
960  
960  
24  
26  
5
5
4
4
> 11.5  
typ. 13  
> 45  
typ. 48  
typ. 14  
typ. 50  
MRA359  
MRA364  
16  
80  
8
handbook, halfpage  
handbook, halfpage  
G
P
(dB)  
P
L
(W)  
η
(%)  
G
P
V
= 26 V  
CE  
12  
60  
40  
6
24 V  
8
4
2
η
20  
0
4
0
0
2
4
6
8
0
0
P
(W)  
200  
400  
600  
800  
L
P
(mW)  
IN  
Class-AB operation; ICQ = 5 mA; f = 960 MHz;  
VCE = 24 V.  
Class-AB operation; ICQ = 5 mA; f = 960 MHz.  
Fig.6 Gain and efficiency as functions of load  
power, typical values.  
Fig.7 Load power as a function of drive power,  
typical values.  
Ruggedness in class-AB operation  
The BLV103 is capable of withstanding a full load  
mismatch corresponding to VSWR = 50:1 through all  
phases at rated output power under the following  
conditions:  
VCE = 24 V; f = 960 MHz; Th = 25 °C;  
Rth mb-h = 0.4 K/W.  
March 1993  
5
Philips Semiconductors  
Product specification  
UHF power transistor  
BLV103  
R2  
L8  
R1  
L6  
C6  
C8  
V
B
V
CC  
C7  
C9  
C10  
L5  
L7  
D.U.T.  
C12  
L9  
C5  
L4  
L1  
L2  
L3  
L11  
L12  
L10  
C1  
C15  
50  
50 Ω  
input  
output  
C2  
C3  
C4  
C11  
C13  
C14  
MDA537  
Fig.8 Class-AB test circuit at f = 960 MHz.  
List of components (see test circuit)  
COMPONENT  
CATALOGUE  
NO.  
DESCRIPTION  
VALUE  
330 pF  
DIMENSIONS  
C1, C6, C7, C8, multilayer ceramic chip capacitor  
C15  
C2, C3, C13,  
C14  
film dielectric trimmer  
1.4 to  
5.5 pF  
2222 809 09001  
2222 128 50228  
C4, C5  
multilayer ceramic chip capacitor  
(note 1)  
5.1 pF  
C9  
35 V solid aluminum capacitor  
multilayer ceramic chip capacitor  
2.2 µF  
C10  
3 × 100 nF  
in parallel  
C11, C12  
L1, L12  
L2, L11  
L3  
multiplayer ceramic chip capacitor (note 2) 6.2 pF  
stripline (note 3)  
50 Ω  
50 Ω  
50 Ω  
43 Ω  
9 mm × 2.4 mm  
23 mm × 2.4 mm  
16 mm × 2.4 mm  
3 mm × 3 mm  
stripline (note 3)  
stripline (note 3)  
L4  
stripline (note 3)  
L5  
3 turns enamelled 0.8 mm copper wire  
int. dia. 3 mm;  
length 5 mm;  
leads 2 mm × 5 mm  
L6, L8  
L7  
grade 3B Ferroxcube wideband HF choke  
4 turns enamelled 0.8 mm copper wire  
4312 020 36642  
2322 151 71009  
int. dia. 4 mm;  
length 5 mm;  
leads 2 mm × 5 mm  
L9  
stripline (note 3)  
43 Ω  
50 Ω  
10 Ω  
14.5 mm × 3 mm  
4.5 mm × 2.4 mm  
L10  
stripline (note 3)  
R1, R2  
0.4 W metal film resistor  
March 1993  
6
Philips Semiconductors  
Product specification  
UHF power transistor  
BLV103  
Notes  
1. American Technical Ceramics (ATC) capacitor, type 100A or other capacitor of the same quality.  
2. American Technical Ceramics (ATC) capacitor, type 100B or other capacitor of the same quality.  
3. The striplines are on a double copper-clad printed circuit board, with PTFE fibre-glass dielectric (εr = 2.2);  
thickness 132 inch.  
122 mm  
copper straps  
copper straps  
rivets  
rivets  
70 mm  
rivets  
rivets  
M2  
copper straps  
copper straps  
M3  
C7  
L6  
L8  
C10  
R2  
C6  
C8  
R1  
C9  
L7  
C12  
L5  
C5  
C4  
C1  
C15  
L10  
C13  
L12  
L1  
L2  
L3  
L11  
L4  
L9  
C11  
C3  
C3  
C14  
MDA536  
The circuit and components are situated on one side of a copper-clad PTFE fibre-glass board; the other side is fully metallized  
and serves as a ground plane. Connections are made by means of fixing screws, hollow rivets and copper straps around the  
board and under the emitters, to provide a direct contact between the components side and the ground plane.  
Fig.9 Component layout for 960 MHz class-AB test circuit.  
March 1993  
7
Philips Semiconductors  
Product specification  
UHF power transistor  
BLV103  
MRA362  
MRA363  
16  
10  
handbook, halfpage  
handbook, halfpage  
Z
i
Z
L
()  
()  
X
L
8
12  
r
i
6
4
8
4
x
i
R
L
2
0
0
840  
840  
880  
920  
960  
1000  
880  
920  
960  
1000  
f (MHz)  
f (MHz)  
Class-AB operation; VCE = 24 V; ICQ = 5 mA;  
Class-AB operation; VCE = 24 V; ICQ = 5 mA;  
PL = 4 W; Th = 25 °C.  
PL = 4 W; Th = 25 °C.  
Fig.11 Load impedance (series components) as a  
function of frequency, typical values.  
Fig.10 Input impedance (series components) as a  
function of frequency, typical values.  
MRA360  
16  
handbook, halfpage  
G
P
(dB)  
12  
8
4
handbook, halfpage  
Z
i
Z
MBA451  
L
0
840  
880  
920  
960  
1000  
f (MHz)  
Class-AB operation; VCE = 24 V; ICQ = 5 mA;  
PL = 4 W; Th = 25 °C.  
Fig.12 Definition of transistor impedance.  
Fig.13 Power gain as a function of frequency,  
typical values.  
March 1993  
8
Philips Semiconductors  
Product specification  
UHF power transistor  
BLV103  
PACKAGE OUTLINE  
Flanged ceramic package; 2 mounting holes; 6 leads  
SOT171A  
D
A
F
B
D
1
U
1
q
C
w
M
H
1
C
2
c
b
1
2
1
4
6
E
H
E
U
1
2
3
5
w
p
A
M
A
B
1
Q
w
b
M
3
e
0
5
10 mm  
scale  
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)  
c
A
b
b
D
D
E
E
e
F
H
H
p
Q
q
U
U
w
w
w
3
UNIT  
1
1
1
1
1
2
1
2
2.15 3.20  
1.85 2.89  
6.81  
6.07  
9.25 9.30 5.95 6.00  
9.04 8.99 5.74 5.70  
3.05 11.31 9.27 3.43 4.32  
2.54 10.54 9.01 3.17 4.11  
24.90 6.00  
24.63 5.70  
0.16  
0.07  
18.42  
0.725  
0.51 1.02 0.26  
0.02 0.04 0.01  
mm  
3.58  
0.085 0.126  
0.073 0.114  
0.268  
0.239  
0.364 0.366 0.234 0.236  
0.356 0.354 0.226 0.224  
0.120 0.445  
0.100 0.415  
0.135 0.170  
0.125 0.162  
0.236  
0.224  
0.006  
0.003  
0.365  
0.355  
0.980  
0.970  
inches  
0.140  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
SOT171A  
97-06-28  
March 1993  
9
Philips Semiconductors  
Product specification  
UHF power transistor  
BLV103  
DEFINITIONS  
Data Sheet Status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
March 1993  
10  
配单直通车
BLV103产品参数
型号:BLV103
生命周期:Transferred
包装说明:,
Reach Compliance Code:unknown
风险等级:5.6
最大集电极电流 (IC):1.2 A
配置:Single
最小直流电流增益 (hFE):20
最高工作温度:200 °C
极性/信道类型:NPN
最大功率耗散 (Abs):17 W
子类别:Other Transistors
表面贴装:NO
Base Number Matches:1
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