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产品型号BQ25896RTWR的Datasheet PDF文件预览

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Documents  
bq25896  
SLUSC76A JULY 2015REVISED SEPTEMBER 2015  
TM  
bq25896 I2C Controlled Single Cell 3-A Fast Charger with MaxCharge Technology for  
High Input Voltage and Adjustable Voltage USB On-the-Go Boost Mode  
1 Features  
Ship Mode  
High Accuracy  
1
High Efficiency 3-A, 1.5-MHz Switch Mode Buck  
Charge  
±0.5% Charge Voltage Regulation  
±5% Charge Current Regulation  
±7.5% Input Current Regulation  
92.5% Charge Efficiency at 2 A and 90.5%  
Charge Efficiency at 3 A Charge Current  
Optimize for High Voltage Input (9 V / 12 V)  
Safety  
Low Power PFM mode for Light Load  
Operations  
Battery Temperature Sensing for Charge and  
Boost Mode  
USB On-the-Go (OTG) with Adjustable Output  
from 4.5 V to 5.5 V  
Thermal Regulation and Thermal Shutdown  
Selectable 500-KHz / 1.5-MHz Boost  
Converter with up-to 2 A Output  
2 Applications  
Smart Phone  
93% Boost Efficiency at 5 V at 1 A Output  
Accurate Hiccup Mode Overcurent Protection  
Support down-to 2.5V Battery  
Tablet PC  
Portable Internet Devices  
3 Description  
Support PWM only or PFM/PWM control for  
Light Load Efficiency  
The bq25896 is a highly-integrated 3-A switch-mode  
battery charge management and system power path  
management device for single cell Li-Ion and Li-  
polymer battery. The devices support high input  
voltage fast charging. The low impedance power path  
optimizes switch-mode operation efficiency, reduces  
battery charging time and extends battery life during  
discharging phase. The I2C Serial interface with  
charging and system settings makes the device a  
truly flexible solution.  
Single Input to Support USB Input and Adjustable  
High Voltage Adapters  
Support 3.9-V to 14-V Input Voltage Range  
Input Current Limit (100 mA to 3.25 A with 50-  
mA resolution) to Support USB2.0, USB3.0  
standard and High Voltage Adapters  
Maximum Power Tracking by Input Voltage  
Limit up-to 14V for Wide Range of Adapters  
Device Information(1)  
Input Current Optimizer (ICO) to Maximize Input  
Power without Overloading Adapters  
PART NUMBER  
PACKAGE  
BODY SIZE (NOM)  
Resistance Compensation (IRCOMP) from  
Charger Output to Cell Terminal  
bq25896  
WQFN (24)  
4.00mm x 4.00mm  
(1) For all available packages, see the orderable addendum at  
the end of the datasheet.  
Highest Battery Discharge Efficiency with 11-mΩ  
Battery Discharge MOSFET up to 9 A  
Simplified Schematic  
Integrated ADC for System Monitor  
(Voltage, Temperature, Charge Current)  
Input  
SYS 3.5Vœ4.5V  
3.9Vœ14V at 3A  
Narrow VDC (NVDC) Power Path Management  
VBUS  
SW  
USB  
Host  
OTG  
Instant-on Works with No Battery or Deeply  
Discharged Battery  
5V at 2A  
SYS  
Ichg = 3A  
Ideal Diode Operation in Battery Supplement  
Mode  
BAT  
I2C Bus  
QON  
BATFET Control to Support Ship Mode, Wake Up,  
and Full System Reset  
Flexible Autonomous and I2C Mode for Optimal  
System Performance  
REGN  
bq25896  
Optional  
Host Control  
TS  
High Integration includes all MOSFETs, Current  
Sensing and Loop Compensation  
12-µA Low Battery Leakage Current to Support  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 
 
 
bq25896  
SLUSC76A JULY 2015REVISED SEPTEMBER 2015  
www.ti.com  
4 Revision History  
Changes from Original (July 2015) to Revision A  
Page  
Changed the datasheet From: Preview To: Production Data ................................................................................................ 1  
Changed OTG From: 5V at 1.5A To: 5V at 2A in the Simplified Schematic.......................................................................... 1  
2
Submit Documentation Feedback  
Copyright © 2015, Texas Instruments Incorporated  
Product Folder Links: bq25896  
bq25896  
www.ti.com  
SLUSC76A JULY 2015REVISED SEPTEMBER 2015  
5 Device and Documentation Support  
5.1 Related Links  
The table below lists quick access links. Categories include technical documents, support and community  
resources, tools and software, and quick access to sample or buy.  
5.2 Community Resources  
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective  
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of  
Use.  
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration  
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help  
solve problems with fellow engineers.  
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and  
contact information for technical support.  
5.3 Trademarks  
E2E is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
5.4 Electrostatic Discharge Caution  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
5.5 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
6 Mechanical, Packaging, and Orderable Information  
The following pages include mechanical, packaging, and orderable information. This information is the most  
current data available for the designated devices. This data is subject to change without notice and revision of  
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
Copyright © 2015, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Links: bq25896  
PACKAGE OPTION ADDENDUM  
www.ti.com  
13-Sep-2015  
PACKAGING INFORMATION  
Orderable Device  
BQ25896RTWR  
BQ25896RTWT  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
ACTIVE  
WQFN  
WQFN  
RTW  
24  
24  
3000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-2-260C-1 YEAR  
BQ  
25896  
ACTIVE  
RTW  
250  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-2-260C-1 YEAR  
-40 to 85  
BQ  
25896  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
13-Sep-2015  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
15-Sep-2015  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
BQ25896RTWR  
BQ25896RTWT  
WQFN  
WQFN  
RTW  
RTW  
24  
24  
3000  
250  
330.0  
180.0  
12.4  
12.4  
4.25  
4.25  
4.25  
4.25  
1.15  
1.15  
8.0  
8.0  
12.0  
12.0  
Q2  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
15-Sep-2015  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
BQ25896RTWR  
BQ25896RTWT  
WQFN  
WQFN  
RTW  
RTW  
24  
24  
3000  
250  
367.0  
210.0  
367.0  
185.0  
35.0  
35.0  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2015, Texas Instruments Incorporated  
配单直通车
BQ25898CYFFR产品参数
型号:BQ25898CYFFR
Brand Name:Texas Instruments
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Active
IHS 制造商:TEXAS INSTRUMENTS INC
包装说明:DSBGA-42
Reach Compliance Code:compliant
ECCN代码:EAR99
Factory Lead Time:1 week
风险等级:1.67
可调阈值:NO
模拟集成电路 - 其他类型:POWER SUPPLY SUPPORT CIRCUIT
JESD-30 代码:R-XBGA-B42
JESD-609代码:e1
长度:2.8 mm
湿度敏感等级:1
信道数量:1
功能数量:1
端子数量:42
最高工作温度:125 °C
最低工作温度:-40 °C
封装主体材料:UNSPECIFIED
封装代码:VFBGA
封装形状:RECTANGULAR
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):260
座面最大高度:0.415 mm
最大供电电流 (Isup):3 mA
最大供电电压 (Vsup):14 V
最小供电电压 (Vsup):3.9 V
表面贴装:YES
温度等级:AUTOMOTIVE
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL
端子节距:0.4 mm
端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:2.4 mm
Base Number Matches:1
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