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  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • BU3056FV-E2
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  • BU3056FV-E2
  • 数量9328 
  • 厂家ROHM-罗姆 
  • 封装TSSOP-16 
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     该会员已使用本站7年以上
  • BU3056FV-E2
  • 数量29500 
  • 厂家Rohm Semiconductor 
  • 封装IC CLOCK GENERATOR 16-SSOP 
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  • 深圳市科雨电子有限公司

     该会员已使用本站9年以上
  • BU3056FV-E2
  • 数量2500 
  • 厂家ROHM 
  • 封装SSOP-16 
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产品型号BU3056FV-E2的Datasheet PDF文件预览

1/4  
Structure  
Product  
Silicon monolithic Integrated circuit  
Clock Generator  
Type  
BU3056FV  
Feature  
To generate clocks for BD-player, BD-recorder system  
Selection of PDB pin enabling Power-Down function  
Absolute Maximum Ratings  
Parameter  
Symbol  
VDD  
VIN  
Tstg  
PD  
Ratings  
Unit  
V
V
Supply voltage  
Input Voltage  
-0.3  
4.0  
VDD+0.3  
-0.3  
Storage Temperature range  
Power dissipation  
-55  
125  
1
mW  
450  
×
1
×
A measure value at mounting on 70mm 70mm 1.6mm glass epoxy substrate.  
In the case of exceeding Ta=25 , 4.5mW should be reduced per 1 .  
The radiation-resistance design is not carried out.  
Operation is not guaranteed.  
Operating Conditions  
Parameter  
Supply voltage  
Input ”H” Voltage  
Input ”L” Voltage  
Operating Temperature  
Output load  
Symbol  
Ratings  
Unit  
3.0 3.6  
0.8VDD VDD  
0.0 0.2VDD  
-20 85  
VDD  
VIH  
VIL  
Topr  
CL  
V
V
V
15 (MAX)  
pF  
Status of this document  
The Japanese version of this document is the formal specification.  
A customer may use this translation version only for a reference to help reading the formal version.  
If there are any differences in translation version of this document, formal version takes priority.  
REV. A  
2/4  
Electrical Characteristics  
VDD=3.3V,Ta=25 ,at No Load ,unless otherwise specified  
Limit  
Parameter  
Symbol  
Unit  
Conditions  
Min.  
28  
Typ.  
59  
53  
Max.  
90  
Pull-up load  
Rpu  
Rpd  
VOH  
VOL  
Input PIN pull-up load value  
kΩ  
kΩ  
V
Pull-down load  
Output H voltage  
Output L voltage  
25  
80  
Input PIN pull-down load value  
2.9  
IOH= 4.0mA  
0.4  
V
IOL=4.0mA  
Consumption  
current1  
Consumption  
current2  
Consumption  
current3  
Consumption  
current4  
MODE1=L, MODE2=L,  
Xtal=12.000MHz  
MODE1=L, MODE2=H,  
Xtal=12.000MHz  
MODE1=H, MODE2=L,  
Xtal=24.576MHz  
MODE1=H, MODE2=H,  
Xtal=25.000MHz  
IDD1  
IDD2  
IDD3  
IDD4  
mA  
mA  
mA  
mA  
16  
25  
22  
13  
21  
33  
29  
17  
Block Diagram  
CLK0  
XIN  
PLL1  
CLK1  
CLK2  
XOUT  
PLL2  
PDB  
Logic  
MODE1  
MODE2  
Output Frequency  
MODE1  
L
MODE2  
L
PDB  
Input Frequency  
CLK0  
CLK1  
CLK2  
L Output  
12.0000MHz  
L Output  
L Output  
33.3333MHz  
L Output  
L Output  
27.0000MHz  
L Output  
L
H
L
12.0000MHz  
12.0000MHz  
12.0000MHz  
12.0000MHz  
L
H
H
H
L
H
12.0000MHz  
60.0000MHz  
48.0000MHz  
L
H
L
24.5760MHz  
24.5760MHz  
L Output  
24.5760MHz  
L Output  
L Output  
L Output  
48.0000MHz  
L Output  
25.0000MHz  
L Output  
25.0000MHz  
25.0000MHz  
H
H
25.0000MHz  
25.0000MHz  
25.0000MHz  
REV. A  
3/4  
Package Outline, Appearance of Marker  
Lot No.  
3056F  
SSOP-B16  
Pin Function  
PIN  
PIN  
No.  
PIN Name  
Function  
PIN Name  
MODE2  
Function  
No.  
MODE control terminal 2  
( CMOS Input )  
1
VDD0  
9
Power supply for CLK0 output  
MODE control terminal 1  
( CMOS Input )  
2
VSS0  
10  
MODE1  
GND for CLK0 output  
3
4
5
6
CLK0  
AVDD  
AVSS  
XIN  
11  
12  
13  
14  
CLK1  
VSS  
CLK0 output terminal  
Analog power supply  
Analog GND  
CLK1 output terminal  
Logic GND  
VDD  
CLK2  
Logic power supply  
CLK2 output terminal  
Crystal input terminal  
Power-Down control terminal  
With pull-up resister  
7
8
XOUT  
TEST  
15  
PDB  
Crystal output terminal  
TEST terminal is normally OPEN  
With pull-down resister  
TEST terminal is normally OPEN  
With pull-down resister  
16  
TEST_B  
Cautions on useBU3056FV)  
·BU3056FV must be basically mounted on the board. (If it is not circuit board mounting, it can't sometimes get a  
character fully.)  
·Capacitors 0.1uF need to be placed between 1PIN(VDD0) and 2PIN(VSS0), 4PIN(AVDD) and 5PIN(AVSS),  
13PIN(VDD) and 12PIN(VSS).  
·It is effective as an EMI countermeasure when the capacitor (less than 1) which puts ferrite beads in the  
starting point of the power supply supplied to the BU3056FV by a circuit board and which makes the power  
supply-GND space have a requested high frequency as to the bypass is inserted.  
·For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal  
powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring,  
width of ground wiring, and routing of wiring.  
REV. A  
4/4  
Cautions on usecommon)  
(1)Absolute Maximum Ratings  
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down  
devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the  
absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc.  
(2)Operating conditions  
These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics  
are guaranteed under the conditions of each parameter.  
(3)Reverse connection of power supply connector  
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the  
reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.  
(4)Power supply line  
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.In this regard, for the digital block  
power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power  
supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power  
supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar  
manner.  
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in  
order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem  
including the occurrence of capacity dropout at a low temperature, thus determining the constant.  
(5)GND voltage  
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to  
be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.  
(6)Short circuit between terminals and erroneous mounting  
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the  
ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply  
or the GND terminal, the ICs can break down.  
(7)Operation in strong electromagnetic field  
Be noted that using ICs in the strong electromagnetic field can malfunction them.  
(8)Inspection with set PCB  
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure  
to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection  
process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn  
OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the  
assembly process and pay thorough attention to the transportation and the storage of the set PCB.  
(9)Input terminals  
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can  
cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough  
attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any  
parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC.  
In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within  
the guaranteed value of electrical characteristics.  
(10)Ground wiring pattern  
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the  
small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and  
voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause  
fluctuations in the GND wiring pattern of external parts as well.  
(11)External capacitor  
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the  
nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.  
REV. A  
Notice  
N o t e s  
No copying or reproduction of this document, in part or in whole, is permitted without the  
consent of ROHM Co.,Ltd.  
The content specified herein is subject to change for improvement without notice.  
The content specified herein is for the purpose of introducing ROHM's products (hereinafter  
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,  
which can be obtained from ROHM upon request.  
Examples of application circuits, circuit constants and any other information contained herein  
illustrate the standard usage and operations of the Products. The peripheral conditions must  
be taken into account when designing circuits for mass production.  
Great care was taken in ensuring the accuracy of the information specified in this document.  
However, should you incur any damage arising from any inaccuracy or misprint of such  
information, ROHM shall bear no responsibility for such damage.  
The technical information specified herein is intended only to show the typical functions of and  
examples of application circuits for the Products. ROHM does not grant you, explicitly or  
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and  
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the  
use of such technical information.  
The Products specified in this document are intended to be used with general-use electronic  
equipment or devices (such as audio visual equipment, office-automation equipment, commu-  
nication devices, electronic appliances and amusement devices).  
The Products specified in this document are not designed to be radiation tolerant.  
While ROHM always makes efforts to enhance the quality and reliability of its Products, a  
Product may fail or malfunction for a variety of reasons.  
Please be sure to implement in your equipment using the Products safety measures to guard  
against the possibility of physical injury, fire or any other damage caused in the event of the  
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM  
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed  
scope or not in accordance with the instruction manual.  
The Products are not designed or manufactured to be used with any equipment, device or  
system which requires an extremely high level of reliability the failure or malfunction of which  
may result in a direct threat to human life or create a risk of human injury (such as a medical  
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,  
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of  
any of the Products for the above special purposes. If a Product is intended to be used for any  
such special purpose, please contact a ROHM sales representative before purchasing.  
If you intend to export or ship overseas any Product or technology specified herein that may  
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to  
obtain a license or permit under the Law.  
Thank you for your accessing to ROHM product informations.  
More detail product informations and catalogs are available, please contact us.  
ROHM Customer Support System  
http://www.rohm.com/contact/  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
R0039  
A
配单直通车
BU3056FV-E2产品参数
型号:BU3056FV-E2
是否无铅:不含铅
是否Rohs认证:符合
生命周期:Obsolete
IHS 制造商:ROHM CO LTD
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.81
Is Samacsys:N
JESD-30 代码:R-PDSO-G16
端子数量:16
最高工作温度:85 °C
最低工作温度:-20 °C
封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP
封装等效代码:TSSOP16,.25
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
电源:3.3 V
认证状态:Not Qualified
子类别:Clock Generators
最大压摆率:33 mA
标称供电电压:3.3 V
表面贴装:YES
温度等级:OTHER
端子形式:GULL WING
端子节距:0.635 mm
端子位置:DUAL
Base Number Matches:1
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