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  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • BUZ90=STP6NK60Z
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  • BUZ90=STP6NK60Z图
  • 深圳市芯福林电子有限公司

     该会员已使用本站15年以上
  • BUZ90=STP6NK60Z
  • 数量65000 
  • 厂家ST 
  • 封装原厂原封 
  • 批号23+ 
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  • BUZ90=STP6NK60Z图
  • 深圳市创思克科技有限公司

     该会员已使用本站2年以上
  • BUZ90=STP6NK60Z
  • 数量10000 
  • 厂家ST 
  • 封装原厂原封 
  • 批号21+ 
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产品型号BUZ90A的Datasheet PDF文件预览

BUZ 90 A  
®
SIPMOS Power Transistor  
• N channel  
• Enhancement mode  
• Avalanche-rated  
Pin 1  
Pin 2  
Pin 3  
G
D
S
Type  
V
DS  
I
R
)
DS(on  
Package  
Ordering Code  
D
BUZ 90 A  
600 V  
4 A  
2 Ω  
TO-220 AB  
C67078-S1321-A3  
Maximum Ratings  
Parameter  
Symbol  
Values  
Unit  
Continuous drain current  
I
I
I
A
D
T = 30 °C  
C
4
Pulsed drain current  
Dpuls  
AR  
T = 25 °C  
C
16  
4.5  
8
Avalanche current,limited by T  
jmax  
Avalanche energy,periodic limited by T  
Avalanche energy, single pulse  
E
mJ  
jmax  
AR  
AS  
E
I = 4.5 A, V = 50 V, R = 25 Ω  
D
DD  
GS  
L = 29 mH, T = 25 °C  
320  
j
±
Gate source voltage  
Power dissipation  
V
P
20  
V
GS  
W
tot  
T = 25 °C  
C
75  
Operating temperature  
Storage temperature  
T
T
-55 ... + 150 °C  
-55 ... + 150  
j
stg  
Thermal resistance, chip case  
R
1.67  
K/W  
thJC  
thJA  
Thermal resistance, chip to ambient  
DIN humidity category, DIN 40 040  
IEC climatic category, DIN IEC 68-1  
R
75  
E
55 / 150 / 56  
Semiconductor Group  
1
07/96  
BUZ 90 A  
Electrical Characteristics, at T = 25°C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ.  
Unit  
min.  
max.  
Static Characteristics  
Drain- source breakdown voltage  
V
V
V
(BR)DSS  
GS(th)  
DSS  
V
GS  
= 0 V, I = 0.25 mA, T = 25 °C  
600  
2.1  
-
-
D
j
Gate threshold voltage  
=
V
V
I = 1 mA  
3
4
GS DS, D  
Zero gate voltage drain current  
I
I
µA  
V
DS  
V
DS  
= 600 V, V = 0 V, T = 25 °C  
-
-
0.1  
10  
1
GS  
j
= 600 V, V = 0 V, T = 125 °C  
100  
GS  
j
Gate-source leakage current  
= 20 V, V = 0 V  
nA  
GSS  
V
GS  
-
-
10  
100  
2
DS  
Drain-Source on-resistance  
= 10 V, I = 2.8 A  
R
DS(on)  
V
GS  
1.7  
D
Semiconductor Group  
2
07/96  
BUZ 90 A  
Electrical Characteristics, at T = 25°C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ.  
Unit  
min.  
max.  
Dynamic Characteristics  
Transconductance  
g
S
fs  
V
2 I  
R I = 2.8 A  
2.5  
3.8  
780  
110  
40  
-
DS  
* D * DS(on)max, D  
Input capacitance  
= 0 V, V = 25 V, f = 1 MHz  
C
C
C
pF  
iss  
oss  
V
-
-
-
1050  
170  
70  
GS  
DS  
Output capacitance  
= 0 V, V = 25 V, f = 1 MHz  
V
GS  
DS  
Reverse transfer capacitance  
= 0 V, V = 25 V, f = 1 MHz  
rss  
V
GS  
DS  
Turn-on delay time  
= 30 V, V = 10 V, I = 2.6 A  
t
t
t
t
ns  
d(on)  
V
DD  
GS  
D
R
GS  
= 50  
-
-
-
-
20  
30  
Rise time  
= 30 V, V = 10 V, I = 2.6 A  
r
V
DD  
GS  
D
R
GS  
= 50  
50  
75  
Turn-off delay time  
= 30 V, V = 10 V, I = 2.6 A  
d(off)  
V
DD  
GS  
D
R
GS  
= 50  
120  
70  
150  
90  
Fall time  
= 30 V, V = 10 V, I = 2.6 A  
f
V
DD  
GS  
D
= 50  
R
GS  
Semiconductor Group  
3
07/96  
BUZ 90 A  
Electrical Characteristics, at T = 25°C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ.  
Unit  
min.  
max.  
Reverse Diode  
Inverse diode continuous forward current I  
A
S
T = 25 °C  
-
-
-
-
-
-
4
16  
1.2  
-
C
Inverse diode direct current,pulsed  
I
SM  
T = 25 °C  
C
-
Inverse diode forward voltage  
V
SD  
V
V
GS  
= 0 V, I = 8 A  
1.1  
350  
3
F
Reverse recovery time  
V = 100 V, I =l di /dt = 100 A/µs  
t
ns  
µC  
rr  
R
F S,  
F
Reverse recovery charge  
Q
rr  
=
V = 100 V, I l di /dt = 100 A/µs  
R
-
F S,  
F
Semiconductor Group  
4
07/96  
BUZ 90 A  
Drain current  
Power dissipation  
ƒ
I = (T )  
ƒ
P
= (T )  
D
C
tot  
C
parameter: V  
10 V  
GS  
4.5  
A
80  
W
ID  
Ptot  
3.5  
60  
50  
40  
30  
20  
10  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
0
0
0
20  
40  
60  
80 100 120  
°C 160  
TC  
20  
40  
60  
80 100 120  
°C 160  
TC  
Safe operating area  
Transient thermal impedance  
ƒ
ƒ
I = (V  
)
Z
= (t )  
th JC  
D
DS  
p
parameter: D = 0.01, T = 25°C  
parameter: D = t / T  
C
p
10 1  
10 2  
K/W  
A
ID  
ZthJC  
t
= 18.0µs  
10 0  
p
10 1  
100 µs  
1 ms  
I
10 -1  
D = 0.50  
V
0.20  
0.10  
0.05  
0.02  
0.01  
10 0  
R
10 -2  
10 ms  
single pulse  
10 -3  
10 -1  
DC  
10 0  
10 1  
10 2  
V 10 3  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1s 10 0  
VDS  
tp  
5
07/96  
Semiconductor Group  
BUZ 90 A  
Typ. output characteristics  
ƒ(  
Typ. drain-source on-resistance  
ƒ(  
I =  
V
)
R
=
I )  
D
D
DS  
DS (on)  
parameter: t = 80 µs  
parameter: V  
p
GS  
l
9
6.5  
P
tot = 75W  
k
i
f
h
g
j
e
a
b
c
A
7
6
5
4
3
2
V
[V]  
5.5  
GS  
a
4.0  
ID  
RDS (on)  
5.0  
d
b
c
d
e
f
4.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
5.5  
6.0  
6.5  
c
g
h
i
7.0  
d
7.5  
8.0  
e
f
j
9.0  
g
h
k
l
10.0  
20.0  
i
j
b
k
V
[V] =  
b
GS  
a
1
0
a
c
d
e
f
g
h
i
j
k
0.5  
0.0  
4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0 10.0 20.0  
0
5
10 15 20 25 30 35 40  
V
50  
0.0  
1.0 2.0  
3.0 4.0  
5.0 6.0  
A
8.0  
VDS  
ID  
Typ. transfer characteristics I = f (V  
)
Typ. forward transconductance g = f (I )  
D
fs  
D
GS  
parameter: t = 80 µs  
parameter: t = 80 µs,  
p
p
V
DS  
2 x I x R  
V
DS  
2 x I x R  
D
DS(on)max  
D
DS(on)max  
5.0  
S
6.0  
A
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
ID  
gfs  
0.5  
0.0  
0.5  
0.0  
0
1
2
3
4
5
6
7
8
V
10  
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0  
A
5.0  
VGS  
ID  
Semiconductor Group  
6
07/96  
BUZ 90 A  
Gate threshold voltage  
Drain-source on-resistance  
ƒ
= (T )  
j
V
ƒ
= (T )  
j
R
GS (th)  
DS (on)  
parameter: V = V , I = 1 mA  
parameter: I = 2.8 A, V = 10 V  
GS  
DS  
D
D
GS  
8.0  
4.6  
V
98%  
4.0  
VGS(th)  
RDS (on)  
3.6  
3.2  
2.8  
2.4  
2.0  
1.6  
1.2  
0.8  
6.0  
5.0  
4.0  
3.0  
2.0  
typ  
2%  
98%  
typ  
1.0  
0.0  
0.4  
0.0  
-60  
-20  
20  
60  
100  
°C  
Tj  
160  
-60  
-20  
20  
60  
100  
°C  
Tj  
160  
Typ. capacitances  
Forward characteristics of reverse diode  
C = f (V )  
ƒ
I = (V  
)
DS  
F
SD  
parameter:V = 0V, f = 1MHz  
parameter: T , t = 80 µs  
GS  
j
p
10 1  
10 2  
nF  
A
IF  
C
10 0  
10 -1  
10 -2  
10 1  
10 0  
10 -1  
Ciss  
Coss  
Tj = 25 °C typ  
Tj = 150 °C typ  
Tj = 25 °C (98%)  
Tj = 150 °C (98%)  
Crss  
0
5
10  
15  
20  
25  
30  
V
40  
0.0  
0.4  
0.8  
1.2  
1.6  
2.0  
2.4  
V
3.0  
VDS  
VSD  
7
07/96  
Semiconductor Group  
BUZ 90 A  
ƒ
Avalanche energy E = (T )  
Typ. gate charge  
AS  
j
ƒ
parameter: I = 4.5 A, V = 50 V  
V
= (Q  
)
D
DD  
GS  
Gate  
R
= 25 , L = 29 mH  
parameter: I  
= 7 A  
D puls  
GS  
340  
mJ  
16  
V
280  
EAS  
VGS  
12  
240  
200  
160  
120  
80  
10  
8
V
V
DS max  
0,2  
0,8  
DS max  
6
4
2
40  
0
0
0
20  
40  
60  
80  
100  
120  
°C  
Tj  
160  
10  
20  
30  
40  
nC  
QGate  
60  
Drain-source breakdown voltage  
ƒ
= (T )  
j
V
(BR)DSS  
710  
V
680  
V(BR)DSS  
660  
640  
620  
600  
580  
560  
540  
-60  
-20  
20  
60  
100  
°C  
Tj  
160  
Semiconductor Group  
8
07/96  
BUZ 90 A  
Package Outlines  
TO-220 AB  
Dimension in mm  
Semiconductor Group  
9
07/96  
配单直通车
BUZ90A产品参数
型号:BUZ90A
是否Rohs认证: 不符合
生命周期:Transferred
IHS 制造商:NORTH AMERICAN PHILIPS DISCRETE PRODUCTS DIV
包装说明:,
Reach Compliance Code:unknown
风险等级:5.91
配置:Single
最大漏极电流 (Abs) (ID):3.5 A
FET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-609代码:e0
工作模式:ENHANCEMENT MODE
最高工作温度:150 °C
极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):75 W
子类别:FET General Purpose Power
表面贴装:NO
端子面层:Tin/Lead (Sn/Pb)
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