品牌
封装规格
- -
- Module30
- Module
- CDIP16
- SOP16
- SOP24
- CDIP18SB
- DSBGA (YBG)-36
- HTQFP (PHP)-48
- SOIC20
- SOLCC8
- 22-LGA-SiP(5.8x4.9)
- 26-QFN(5x5)
- 36-DSBGA(2.63x2.46)
- 42-WLCSP(2.77x2.5)
- 68-PLCC
- ALH-144
- DIP40
- DSBGA(YBG)-36
- FCCSP (ALH)-144
- LDCC28
- LQFP
- LQFP (PBK)-128
- Module0
- NFBGA (ZAW)-100
- PLCC68
- QFN68
- QFP208
- SOIC16
- SOP28
- TO-220-6M
- TQFP100
- TQFP32
- TQFP64
- TSOP48
- VQFN (RHB)-32