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●Cautions on use
1．Absolute maximum ratings
This IC might be destroyed when the absolute maximum ratings, such as impressed voltage (PVcc, Vcc) or the operating temperature range
(Topr), is exceeded, and whether the destruction is short circuit mode or open circuit mode cannot be specified. Please take into consideration
the physical countermeasures for safety, such as fusing, if a particular mode that exceeds the absolute maximum rating is assumed.
2．Reverse polarity connection
Connecting the power line to the IC in reverse polarity (from that recommended) will damage the part. Please utilize the direction protection
device as a diode in the supply line.
3．GND line
The ground line is where the lowest potential and transient voltages are connected to the IC.
4．Thermal design
Do not exceed the power dissipation (Pd) of the package specification rating under actual operation, and please design enough temperature
margins.
5．Short circuit mode between terminals and wrong mounting
Do not mount the IC in the wrong direction and be careful about the reverse-connection of the power connector.
Moreover, this IC might be destroyed when the dust short the terminals between them or GND.
6．Radiation
Strong electromagnetic radiation can cause operation failures.
7．ASO (Area of Safety Operation)
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
8．TSD (Thermal Shut-Down)
The TSD is activated when the junction temperature (Tj) reaches 1750C (with +/-250C hysteresis), and the output terminal is switched to Hi-z. The
TSD circuit designed to shut the IC off to prevent runaway thermal operation. It is not designed to protect or guarantee its operation. Do not
continue to use the IC after operating this circuit.
9．Vcc, GND and RNF wiring layout
Vcc, GND and RNF layout should be as wide as possible and at minimum distance. Wire to ground to prevent Vcc-PVcc and GND-PGND-GND
side of RNF resistor from having common impedance. Connect a capacitor between Vcc and GND to stabilize.
10．Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements to keep them isolated. PN junctions are formed at the
intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each
potential is as follows:
When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode.
When Pin B > GND > Pin A, the PN junction operates as a parasitic transistor.
Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits,
operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the
GND (P substrate) voltage to an input pin, should not be used.
Simplified structure of IC
11．Capacitor between Vcc and GND
This IC has steep change of the voltage and current because of PWM driver. Therefore, the capacitor controls Vcc voltage by attaching a
capacitor between Vcc and GND. Wiring impedance decreases the capacitors capabilities if the capacitor is far from the IC. Therefore, a
capacitor should be placed between Vcc and GND, close to the IC.
12．Supply fault, ground fault and short-circuit between output terminals
Do not short-circuit between any output terminal and supply terminal (supply fault) or ground (ground fault), or between any output terminals (load
short-circuit). When mounting the IC on the circuit board, be extremely cautious about the orientation of the IC. If the orientation is mistaken, the
IC may break down and produce smoke in some cases.
13．Inspection by the set circuit board
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge
capacitors after each process or step. Always turn the IC’s power supply off before connecting it to, or removing it from a jig or fixture, during the
inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting and storing the IC.
14．Reverse-rotation braking
High-speed rotation may cause reverse-rotation braking. Monitor the voltage applied to the output terminal and consider the revolutions applied to
the reversed-rotation brake.
15．Application circuit
It is one sample that explains standard operation and usage of this IC about the described example of the application circuit and information on
the constant etc. Therefore, please be sure to consult with our sales representative in advance before mass production design, when a circuit
different from application circuit is composed of external.
REV. B