欢迎访问ic37.com |
会员登录 免费注册
发布采购
所在地: 型号: 精确
  • 批量询价
  •  
  • 供应商
  • 型号
  • 数量
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
  •  
  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • BU2JTH5WNVX-TL
  • 数量-
  • 厂家-
  • 封装-
  • 批号-
  • -
  • QQ:857273081QQ:857273081 复制
    QQ:1594462451QQ:1594462451 复制
  • 010-62104931、62106431、62104891、62104791 QQ:857273081QQ:1594462451
更多
  • BU2JTH5WNVX-TL图
  • 深圳市隆鑫创展电子有限公司

     该会员已使用本站15年以上
  • BU2JTH5WNVX-TL 现货库存
  • 数量4898 
  • 厂家ROHM 
  • 封装SSOP-4 
  • 批号15+ROHS 
  • 一手代理货源&价格可谈可含税%配单侠
  • QQ:2355878626QQ:2355878626 复制
    QQ:2850299242QQ:2850299242 复制
  • 0755-82812278 QQ:2355878626QQ:2850299242
  • BU2JTH5WNVX-TL图
  • 昂富(深圳)电子科技有限公司

     该会员已使用本站4年以上
  • BU2JTH5WNVX-TL
  • 数量56285 
  • 厂家ROHM 
  • 封装SSOP-4 
  • 批号24+ 
  • 一站式BOM配单,短缺料找现货,怕受骗,就找昂富电子.
  • QQ:GTY82dX7
  • 0755-23611557【陈妙华 QQ:GTY82dX7
  • BU2JTH5WNVX-TL图
  • 深圳市惊羽科技有限公司

     该会员已使用本站11年以上
  • BU2JTH5WNVX-TL
  • 数量9328 
  • 厂家ROHM-罗姆 
  • 封装DFN-贴片 
  • 批号▉▉:2年内 
  • ▉▉¥4.1元一有问必回一有长期订货一备货HK仓库
  • QQ:43871025QQ:43871025 复制
  • 131-4700-5145---Q-微-恭-候---有-问-秒-回 QQ:43871025
  • BU2JTH5WNVX-TL图
  • 深圳市芯鹏泰科技有限公司

     该会员已使用本站8年以上
  • BU2JTH5WNVX-TL
  • 数量7536 
  • 厂家Rohm Semiconductor 
  • 封装SSON004X1010 
  • 批号23+ 
  • 稳压器线性原装现货
  • QQ:892152356QQ:892152356 复制
  • 0755-82777852 QQ:892152356
  • BU2JTH5WNVX-TL图
  • 现代芯城(深圳)科技有限公司

     该会员已使用本站15年以上
  • BU2JTH5WNVX-TL
  • 数量60000 
  • 厂家一级代理 
  • 封装一级代理 
  • 批号一级代理 
  • 一级代理正品采购
  • QQ:3007226851QQ:3007226851 复制
    QQ:3007226849QQ:3007226849 复制
  • 0755-82542579 QQ:3007226851QQ:3007226849
  • BU2JTH5WNVX-TL图
  • 深圳市惠诺德电子有限公司

     该会员已使用本站7年以上
  • BU2JTH5WNVX-TL
  • 数量29500 
  • 厂家Rohm Semiconductor 
  • 封装IC REG LINEAR 2.85V 500MA 4SSON 
  • 批号21+ 
  • 只做原装现货代理
  • QQ:1211267741QQ:1211267741 复制
    QQ:1034782288QQ:1034782288 复制
  • 159-7688-9073 QQ:1211267741QQ:1034782288
  • BU2JTH5WNVX-TL图
  • 深圳市宇川湘科技有限公司

     该会员已使用本站6年以上
  • BU2JTH5WNVX-TL
  • 数量23000 
  • 厂家Rohm 
  • 封装SSON004X1010 
  • 批号23+ 
  • 原装正品现货,郑重承诺只做原装!
  • QQ:2885348305QQ:2885348305 复制
    QQ:2885348305QQ:2885348305 复制
  • 0755-84534256 QQ:2885348305QQ:2885348305
  • BU2JTH5WNVX-TL图
  • 深圳市博正芯科技有限公司

     该会员已使用本站6年以上
  • BU2JTH5WNVX-TL
  • 数量12000 
  • 厂家Rohm Semiconductor 
  • 封装正品 
  • 批号21+ 
  • ★★正品专卖,进口原装深圳现货★★
  • QQ:639834857QQ:639834857 复制
    QQ:1487625604QQ:1487625604 复制
  • 0755-82545278 QQ:639834857QQ:1487625604
  • BU2JTH5WNVX-TL图
  • 深圳市一线半导体有限公司

     该会员已使用本站11年以上
  • BU2JTH5WNVX-TL
  • 数量10814 
  • 厂家Rohm Semiconductor 
  • 封装 
  • 批号 
  • 全新原装部分现货其他订货
  • QQ:2881493920QQ:2881493920 复制
    QQ:2881493921QQ:2881493921 复制
  • 0755-88608801多线 QQ:2881493920QQ:2881493921
  • BU2JTH5WNVX-TL图
  • 深圳市科雨电子有限公司

     该会员已使用本站9年以上
  • BU2JTH5WNVX-TL
  • 数量9854 
  • 厂家ROHM 
  • 封装DFN 
  • 批号24+ 
  • ★体验愉快问购元件!!就找我吧!单价:6元
  • QQ:97671956QQ:97671956 复制
  • 171-4729-1886(微信同号) QQ:97671956

产品型号BU2JTH5WNVX-TL的Datasheet PDF文件预览

Datasheet  
CMOS LDO Regulator for Portable Equipments  
High Ripple Rejection,  
Low Current Consumption,  
Versatile Package  
FULL CMOS LDO Regulator (2.85V / 500mA)  
BU2JTH5WNVX  
General Description  
Key Specifications  
BU2JTH5WNVX is high-performance FULL CMOS  
regulator with 500-mA output, which is mounted on  
versatile package SSON004X1010 (1.00mm × 1.00 mm  
× 0.60mm). It has excellent ripple rejection, noise  
characteristics and load responsiveness characteristics  
despite its low circuit current consumption of 10μA. It is  
most appropriate for various applications such as power  
supplies for logic IC, RF, and camera modules.  
„
„
„
„
„
Output voltage:  
2.85V  
±1.0%  
80dB@1KHz  
10μA (TYP)  
-20°C to +85°C  
Accuracy output voltage:  
Power Supply rejection Ratio:  
Low current consumption:  
Operating temperature range:  
Applications  
Smartphone, Battery-powered portable equipment, etc.  
Features  
Package  
„
„
„
„
High accuracy detection  
High ripple rejection  
low current consumption  
SSON004X1010 :  
1.00mm x 1.00mm x 0.60mm  
Compatible with small ceramic capacitor  
(Cin=Co=1.0uF)  
„
„
„
With built-in output discharge circuit  
ON/OFF control of output voltage  
With built-in over current protection circuit  
Typical Application Circuit  
CE  
CE  
VOUT  
VOUT  
1.0µF  
VIN  
VIN  
1.0µF  
GND  
GND  
GND  
Figure 1. Application Circuit  
Product structureSilicon monolithic integrated circuit This product is not designed for protection against radioactive rays  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
TSZ2211114001  
TSZ02201-0RBR0A300190-1-2  
07.Jan.2014.Rev.001  
1/10  
Datasheet  
BU2JTH5WNVX  
Connection Diagram  
SSON004X1010 TOP VIEW  
BOTTOM VIEW  
1 VOUT  
4 VIN  
3 CE  
2 GND  
LOT Number  
reverse FIN  
6 i  
Part Number Marking  
1PIN MARK  
4 VIN  
3 CE  
2 GND  
1 VOUT  
Pin Descriptions  
SSON004X1010  
PIN No.  
Symbol  
VOUT  
GND  
Function  
Output Voltage  
Grounding  
1
2
ON/OFF control of output voltage  
(High: ON, Low: OFF)  
Power Supply Voltage  
Substrate (Connect to GND)  
3
CE  
4
VIN  
FIN  
reverse  
Ordering Information  
B
U
2
J
T
H
5
W
N
V
X
-
T
L
Part  
Number  
Output Voltage  
2J : 2.85V  
High Ripple Rejection  
Maximum Output Current  
500mA  
with Package  
output discharge NVX : SSON004X1010  
Packageing and forming specification  
Embossed tape and reel  
TL : The pin number 1 is the lower left  
SSON004X1010  
1.0 0.1  
<Tape and Reel information>  
1PIN MARK  
Tape  
Embossed carrier tape  
5000pcs  
Quantity  
TL  
Direction  
of feed  
S
The direction is the 1pin of product is at the lower left when you hold  
reel on the left hand and you pull out the tape on the left hand  
(
)
0.05  
0.65 0.05  
3-C0.18  
R0.05  
1
2
45º  
4
3
Direction of feed  
1pin  
0.25 0.05  
Reel  
Order quantity needs to be multiple of the minimum quantity.  
(Unit : mm)  
Absolute Maximum Ratings (Ta=25°C)  
PARAMETER  
Symbol  
Limit  
Unit  
V
VMAX  
Pd  
-0.3 to +5.5  
560 (Note1)  
+125  
Power Supply Voltage  
mW  
°C  
Power Dissipation  
TjMAX  
Topr  
Maximum junction temperature  
Operating Temperature Range  
Storage Temperature Range  
-20 to +85  
°C  
Tstg  
-55 to +125  
°C  
(Note1) Pd deleted at 5.6mW/°C at temperatures above Ta=25°C, mounted on 70×70×1.6 mm glass-epoxy PCB.  
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the  
absolute maximum ratings.  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
TSZ02201-0RBR0A300190-1-2  
2/10  
07.Jan.2014.Rev.001  
TSZ2211115001  
Datasheet  
BU2JTH5WNVX  
RECOMMENDED OPERATING RANGE (not to exceed Pd)  
PARAMETER  
Symbol  
VIN  
Limit  
Unit  
V
Power Supply Voltage  
1.7 to 5.0  
Maximum Output Current  
IMAX  
500  
mA  
OPERATING CONDITIONS  
PARAMETER  
Symbol  
MIN.  
TYP.  
MAX.  
-
Unit  
CONDITION  
Ceramic capacitor recommended  
Input Capacitor  
Cin  
1.0 (Note2)  
-
μF  
Output Capacitor  
Co  
1.0 (Note2)  
-
-
μF  
(Note2) Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias, changing as time  
progresses characteristic.  
Electrical Characteristics  
(Ta=25°C, VIN=4.3V, CIN=1.0μF, Co=1.0μF, unless otherwise noted.)  
Limits  
Parameter  
Input Voltage  
Symbol  
Unit  
Conditions  
Min.  
1.7  
Typ.  
-
Max.  
5.0  
VIN  
V
V
VOUT  
×0.99  
VOUT  
×1.01  
Output Voltage  
VOUT  
VOUT  
IOUT=10µA  
Line Regulation  
Load Regulation  
VOUT-line  
VOUT-load  
-
-
-
20  
40  
mV  
mV  
From (VOUT+0.3V) to 5.0V, IOUT=10mA  
IOUT=5mA to 250mA  
21  
Voltage Dropout  
Vdrop-out  
-
160  
250  
mV  
IOUT=250mA  
Load Current  
Iload  
Icq  
500  
-
-
20  
-
mA  
µA  
dB  
No Load Quiescent Current  
-
-
10  
82  
IOUT=0mA  
fRR=100Hz  
RR1  
Power Supply  
Rejection Ratio  
RR2  
-
80  
-
dB  
fRR=1kHz  
Output Noise Voltage  
Noise  
Topr  
-
40  
-
-
nVHz @10KHz  
Operating Temperature range  
Discharge Resistor  
-20  
20  
85  
80  
8.0  
5.0  
0.3  
°C  
RDSC  
ISTB  
VCEH  
50  
0.9  
-
CE Pin Pull-down Current  
0.1  
1.2  
-0.3  
uA  
V
ON  
OFF  
CE Pin Control Voltage  
VCEL  
-
V
Block Diagrams  
VIN  
VIN  
VREF  
VOUT  
VOUT  
CIN  
OCP  
GND  
Co  
CE  
CIN・・・1.0μF (Ceramic capacitor)  
Co ・・・1.0μF (Ceramic capacitor)  
CE  
Figure 2. Block Diagrams  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0RBR0A300190-1-2  
07.Jan.2014.Rev.001  
3/10  
Datasheet  
BU2JTH5WNVX  
Reference data (Ta=25ºC unless otherwise specified.)  
LINEꢀREGULATION  
2.88  
Load Regulation  
2.950  
2.900  
2.850  
2.800  
2.750  
-20℃  
25℃  
85℃  
VIN=3.85V  
CE=VIN  
-20℃  
CE=VIN  
Iout=10mA  
25℃  
2.87  
2.86  
2.85  
2.84  
2.83  
2.82  
2.81  
2.80  
2.79  
85℃  
0
50  
100  
150  
IOUT[mA]  
200  
250  
3.3  
3.8  
4.3  
VIN[V]  
4.8  
Figure 3.  
Figure 4.  
OUTPUT VOLTAGE vs TEMPERATURE  
GROUND PIN CURRENT vs INPUT VOLTAGE  
2.95  
2.90  
2.85  
2.80  
2.75  
20  
15  
10  
5
VIN=3.85V  
CE=VIN  
IOUT=10uA  
-20℃  
CE=VIN  
IOUT=0mA  
25℃  
85℃  
0
-20  
0
20 40  
Temperature[℃]  
60  
80  
3.9  
4.4  
4.9  
5.4  
VIN[V]  
Figure 6.  
Figure 5.  
GROUND PIN CURRENT vs TEMPERATURE  
GROUND PIN CURRENT vs LOAD  
20  
18  
16  
14  
12  
10  
8
300  
200  
100  
0
VIN=3.85V  
CE=VIN  
IOUT=0mA  
VIN=3.85V  
CE=VIN  
Ta=25℃  
6
4
2
0
-20  
0
20 40  
Temperature[℃]  
60  
80  
0
100  
200  
300  
400  
500  
IOUT [mA]  
Figure 8.  
Figure 7.  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0RBR0A300190-1-2  
07.Jan.2014.Rev.001  
4/10  
Datasheet  
BU2JTH5WNVX  
Reference data (Ta=25ºC unless otherwise specified.)  
OCP  
PSRR vs FREQUENCY  
3.5  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
VIN=3.85V  
CE=VIN  
Ta=25℃  
VIN=4.3V  
CE=VIN  
Ta=25℃  
3.0  
IOUT=150mA  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
100  
1,000  
10,000  
100,000  
1,000,000  
0
100 200 300 400 500 600 700 800 900 1000 1100  
IOUT [mA]  
Frequency[Hz]  
Figure 10.  
Figure 9.  
LINE TRANSIENT RESPONSE  
LINE TRANSIENT RESPONSE  
VOUT  
2.85V  
VOUT  
2.85V  
4.2V  
4.2V  
3.2V  
CE=VIN  
Ta=25℃  
Iout=10mA  
CE=VIN  
Ta=25℃  
Iout=150mA  
VIN  
VIN  
3.2V  
Figure 11.  
Figure 12.  
START UP TIME  
DISCHARGE TIME  
1.5V  
CE  
1.5V  
CE  
0V  
0V  
VIN=3.85V  
Ta=25℃  
Iout=0mA  
Cout=1.0uF  
VOUT  
VOUT  
VIN=3.85V  
Ta=25℃  
Iout=0mA  
Cout=1.0uF  
40µs/div  
20µs/div  
Figure 14.  
Figure 13.  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0RBR0A300190-1-2  
07.Jan.2014.Rev.001  
5/10  
Datasheet  
BU2JTH5WNVX  
Reference data (Ta=25ºC unless otherwise specified.)  
LOAD TRANSIENT RESPONSE  
Trise=12us  
SHUTDOWN CURRENT vs INPUT VOLTAGE  
10.00  
1.00  
0.10  
0.01  
VIN=5.5V  
CE=0V  
250mA  
IOUT  
1mA  
VOUT  
VIN=3.85V  
CE=VIN  
Ta=25℃  
-20  
0
20  
40  
60  
80  
Temperature[℃]  
20µs/div  
Figure 16.  
Figure 15.  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0RBR0A300190-1-2  
07.Jan.2014.Rev.001  
6/10  
Datasheet  
BU2JTH5WNVX  
About power dissipation (Pd)  
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of  
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the  
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is  
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original  
IC performance, such as reduction in current capability. Therefore, be sure to prepare sufficient margin within power  
dissipation for usage.  
Calculation of the maximum internal power consumption of IC (PMAX)  
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)  
Measurement conditions  
Standard ROHM Board  
Top Layer (Top View)  
Bottom Layer (Top View)  
Evaluation Board 1  
Layout of Board for  
Measurement  
Top Layer (Top View)  
IC  
Implementation  
Position  
Bottom Layer (Top View)  
Measurement State  
Board Material  
Board Size  
With board implemented (Wind speed 0 m/s) With board implemented (Wind speed 0 m/s)  
Glass epoxy resin (Double-side board)  
70 mm x 70 mm x 1.6 mm  
Glass epoxy resin (Double-side board)  
40 mm x 40 mm x 1.6 mm  
Top layer  
Wiring  
Metal (GND) wiring rate: Approx. 0%  
Metal (GND) wiring rate: Approx. 50%  
Bottom  
Rate  
Metal (GND) wiring rate: Approx. 50%  
Metal (GND) wiring rate: Approx. 50%  
layer  
Through Hole  
Diameter 0.5mm x 6 holes  
0.56W  
Diameter 0.5mm x 25 holes  
0.39W  
Power Dissipation  
Thermal Resistance  
θja=178.6°C/W  
θja=256.4°C/W  
0.6  
0.56W  
0.5  
0.4  
0.39W  
0.3  
* Please design the margin so that  
PMAX becomes is than Pd (PMAX<Pd)  
within the usage temperature range  
0.2  
0.1  
0
0
25  
50  
75  
100  
125  
85  
Ta [  
]
Figure 17. SSON004X1010 Power dissipation heat reduction characteristics (Reference)  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0RBR0A300190-1-2  
07.Jan.2014.Rev.001  
7/10  
Datasheet  
BU2JTH5WNVX  
Operational Notes  
1. Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply  
pins.  
2. Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the  
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog  
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and  
aging on the capacitance value when using electrolytic capacitors.  
3. Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.  
4. Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5. Thermal Consideration  
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in  
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when  
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,  
increase the board size and copper area to prevent exceeding the Pd rating.  
6. Recommended Operating Conditions  
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.  
The electrical characteristics are guaranteed under the conditions of each parameter.  
7. Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow  
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.  
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing  
of connections.  
8. Operation Under Strong Electromagnetic Field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
9. Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject  
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should  
always be turned off completely before connecting or removing it from the test setup during the inspection process. To  
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and  
storage.  
10. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0RBR0A300190-1-2  
07.Jan.2014.Rev.001  
8/10  
Datasheet  
BU2JTH5WNVX  
Operational Notes – continued  
11. Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge  
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause  
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power  
supply or ground line.  
12. Regarding the Input Pin of the IC  
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation  
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.  
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower  
than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power  
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have  
voltages within the values specified in the electrical characteristics of this IC.  
13. Voltage of CE pin  
To enable standby mode for all channels, set the CE pin to 0.3 V or less, and for normal operation, to 1.2 V or more.  
Setting CE to a voltage between 0.3 and 1.2 V may cause malfunction and should be avoided. Keep transition time  
between high and low (or vice versa) to a minimum.  
Additionally, if CE is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing  
a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present,  
overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always  
be completely discharged before turning the IC on.  
14. Ceramic Capacitor  
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
15. Area of Safe Operation (ASO)  
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe  
Operation (ASO).  
16. Over Current Protection Circuit (OCP)  
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This  
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should  
not be used in applications characterized by continuous operation or transitioning of the protection circuit.  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0RBR0A300190-1-2  
07.Jan.2014.Rev.001  
9/10  
Datasheet  
BU2JTH5WNVX  
Revision History  
Date  
Revision  
001  
Changes  
07.Jan.2014  
New Release.  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0RBR0A300190-1-2  
07.Jan.2014.Rev.001  
10/10  
Daattaasshheeeett  
Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice - GE  
Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice - GE  
Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2014 ROHM Co., Ltd. All rights reserved.  
配单直通车
BU3056FV产品参数
型号:BU3056FV
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Obsolete
零件包装代码:SOIC
包装说明:SSOP-16
针数:16
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.83
JESD-30 代码:R-PDSO-G16
JESD-609代码:e2
长度:5 mm
端子数量:16
最高工作温度:85 °C
最低工作温度:-20 °C
最大输出时钟频率:60 MHz
封装主体材料:PLASTIC/EPOXY
封装代码:LSSOP
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260
主时钟/晶体标称频率:25 MHz
认证状态:Not Qualified
座面最大高度:1.35 mm
最大供电电压:3.6 V
最小供电电压:3 V
标称供电电压:3.3 V
表面贴装:YES
技术:CMOS
温度等级:OTHER
端子面层:Tin/Copper (Sn/Cu)
端子形式:GULL WING
端子节距:0.65 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:4.4 mm
uPs/uCs/外围集成电路类型:CLOCK GENERATOR, OTHER
Base Number Matches:1
  •  
  • 供货商
  • 型号 *
  • 数量*
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
批量询价选中的记录已选中0条,每次最多15条。
 复制成功!